Breaking the microprocessor barrier

UC Berkeley researchers broke through the microprocessor performance roadblock with two revolutionary transistor designs — Silicon-On-Insulator and 3D FinFET — that allow microchips to process information faster in a smaller footprint, with less power and more reliability. Embraced as the preferred next-generation technologies, the UC Berkeley designs are set to underpin the $304 billion semiconductor industry over the next 15 years. Leading chip manufacturer Intel Corporation is scheduled to begin general production of its 3D transistor by the end of 2011.